Chapter 55. High Temperature Slow Crack Growth of Sl3N4 Specimens Subjected to Uniaxial and Biaxial Dynamic Fatigue Loading Conditions

  1. John B. Wachtman Jr
  1. Sung R. Choi,
  2. Noel N. Nemeth,
  3. Jonathan A. Salem,
  4. Lynn M. Powers and
  5. John P. Gyekenyesi

Published Online: 26 MAR 2008

DOI: 10.1002/9780470314715.ch55

Proceedings of the 19th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - A: Ceramic Engineering and Science Proceedings, Volume 16, Issue 4

Proceedings of the 19th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - A: Ceramic Engineering and Science Proceedings, Volume 16, Issue 4

How to Cite

Choi, S. R., Nemeth, N. N., Salem, J. A., Powers, L. M. and Gyekenyesi, J. P. (2008) High Temperature Slow Crack Growth of Sl3N4 Specimens Subjected to Uniaxial and Biaxial Dynamic Fatigue Loading Conditions, in Proceedings of the 19th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - A: Ceramic Engineering and Science Proceedings, Volume 16, Issue 4 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470314715.ch55

Author Information

  1. NASA Lewis Research Center, Cleveland, OH 44135

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1995

ISBN Information

Print ISBN: 9780470375372

Online ISBN: 9780470314715

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Keywords:

  • fatigue;
  • parameter;
  • uniaxial;
  • specimens;
  • flexural

Summary

The slow crack growth of a hot-pressed silicon nitride was determined at 1300°C in abusing dynmaic fatigue testing under both uniaxial and biaxial stress states. Good agreement in fatigue parameter exists between the data obtained from uniaxial and biaxial loading conditions. A reasonable prediction of dynamic fatigue from one stress state to another was made using the recently developed CARES/LIFE computer code.