Chapter 18. Microwave Joining of High-Purity Alumina

  1. John B. Wachtman Jr.
  1. A. D. Cozzi1,
  2. D. E. Clark1 and
  3. M. K. Ferber2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470314821.ch18

Proceedings of the 20th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - A: Ceramic Engineering and Science Proceedings, Volume 17, Issue 3

Proceedings of the 20th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - A: Ceramic Engineering and Science Proceedings, Volume 17, Issue 3

How to Cite

Cozzi, A. D., Clark, D. E. and Ferber, M. K. (1996) Microwave Joining of High-Purity Alumina, in Proceedings of the 20th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - A: Ceramic Engineering and Science Proceedings, Volume 17, Issue 3 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470314821.ch18

Author Information

  1. 1

    Department of Materials Science & Engineering, University of Florida, Gainesville, FL 32611–6400

  2. 2

    Oak Ridge National Laboratory, P.O. BOX 2008 MS-6069, Oak Ridge, TN 37831

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1996

ISBN Information

Print ISBN: 9780470375426

Online ISBN: 9780470314821

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Keywords:

  • utilized;
  • parameters;
  • diffusion;
  • purities;
  • parameters

Summary

Microwave hybrid heating (MHH) was used to join 99.5% pure alumina pieces 25 mm diameter and 25 mm long using 94% pure alumina as the interlayer material. The interlayer material was cut from a rod into discs approximately 2 mm thick.

Joining was performed in a home model microwave oven. Temperatures for joining ranged from 1450 °C to 1550 °C and pressures from 1–3 MPa. For comparison, similar joints were made in a conventional furnace.

Joined specimens were tested using four-point bend at room temperature. Statistical analysis was utilized to determine the relative effect of the different processing parameters on the strength of the joint.