Chapter 14. Material Improvement Through Iterative Process Development
- William Smothers
Published Online: 26 MAR 2008
DOI: 10.1002/9780470320167.ch14
Copyright © 1983 The American Ceramic Society
Book Title
Proceedings of the 7th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 4, Issue 9/10
Additional Information
How to Cite
Richerson, D. W., Smyth, J. R. and Styhr, K. H. (2008) Material Improvement Through Iterative Process Development, in Proceedings of the 7th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 4, Issue 9/10 (ed W. Smothers), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470320167.ch14
Publication History
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1983
Book Series:
ISBN Information
Print ISBN: 9780470374047
Online ISBN: 9780470320167
- Summary
- Chapter
- References
Keywords:
- reliability;
- sintered;
- reliability;
- optimized;
- schematically
Summary
The use of an iterative process development approach is described for improvement of the properties and reliability of hot-pressed silicon nitride, slip-cast reaction-bonded silicon nitride, and injection-molded sintered silicon nitride. The 1375°C strength of the hot-pressed silicon nitride was increased from 140 MPa to >350 MPa, and the Weibull slope was increased from 7.2 to >10. The room-temperature strength of slip-cast reaction-bonded silicon nitride was improved from typically 220 MPa with a Weibull slope of 7.8 to 330 MPa with a Weibull slope of 15.8. The room-temperature and 1230°C strength of injection-molded sintered silicon nitride were increased respectively from 495 to 765 MPa and from 360 to 575 MPa.