Chapter 32. Dynamic and Static Fatigue Behavior of Sintered Silicon Nitrides

  1. William Smothers
  1. J. Chang,
  2. P. Khandelwal and
  3. P. W. Heitman

Published Online: 26 MAR 2008

DOI: 10.1002/9780470320402.ch32

11th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 8, Issue 7/8

11th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 8, Issue 7/8

How to Cite

Chang, J., Khandelwal, P. and Heitman, P. W. (2008) Dynamic and Static Fatigue Behavior of Sintered Silicon Nitrides, in 11th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 8, Issue 7/8 (ed W. Smothers), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470320402.ch32

Author Information

  1. Allison Gas Turbine, G. M. Corp. P.O. Box 420 Indianapolis, IN 46206

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1987

ISBN Information

Print ISBN: 9780470374733

Online ISBN: 9780470320402

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Keywords:

  • fractographic;
  • microcracking;
  • lifetime predictions;
  • stressing;
  • assuming

Summary

The dynamic and static fatigue behavior of Kyocera SN220M sintered silicon nitride at 1000°C was studied. Fractographic analysis of the material failing in dynamic fatigue revealed the presence of slow crack growth (SCG) at stressing rates below 41 MPa/min (6 ksi/min). Under conditions of static fatigue this material also displayed SCG at stresses below 345 MPa (50 ksi). Slow crack growth appears to be controlled by microcracking of the grain boundaries. The crack velocity exponent (n) determined from both dynamic and static fatigue tests ranged from 11 to 16.