Chapter 32. Dynamic and Static Fatigue Behavior of Sintered Silicon Nitrides
- William Smothers
Published Online: 26 MAR 2008
Copyright © 1987 The American Ceramic Society, Inc.
11th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 8, Issue 7/8
How to Cite
Chang, J., Khandelwal, P. and Heitman, P. W. (2008) Dynamic and Static Fatigue Behavior of Sintered Silicon Nitrides, in 11th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 8, Issue 7/8 (ed W. Smothers), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470320402.ch32
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1987
Print ISBN: 9780470374733
Online ISBN: 9780470320402
- lifetime predictions;
The dynamic and static fatigue behavior of Kyocera SN220M sintered silicon nitride at 1000°C was studied. Fractographic analysis of the material failing in dynamic fatigue revealed the presence of slow crack growth (SCG) at stressing rates below 41 MPa/min (6 ksi/min). Under conditions of static fatigue this material also displayed SCG at stresses below 345 MPa (50 ksi). Slow crack growth appears to be controlled by microcracking of the grain boundaries. The crack velocity exponent (n) determined from both dynamic and static fatigue tests ranged from 11 to 16.