Chapter 1. Microsensor Packaging and System Partitioning
- William Smothers
Published Online: 27 MAR 2008
Copyright © 1987 The American Ceramic Society, Inc.
14th Automotive Materials Conference: Ceramic Engineering and Science Proceedings, Volume 8, Issue 9/10
How to Cite
Senturia, S. D. and Smith, R. L. (2008) Microsensor Packaging and System Partitioning, in 14th Automotive Materials Conference: Ceramic Engineering and Science Proceedings, Volume 8, Issue 9/10 (ed W. Smothers), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470320419.ch1
- Published Online: 27 MAR 2008
- Published Print: 1 JAN 1987
Print ISBN: 9780470374740
Online ISBN: 9780470320419
While the problem of packaging of conventional microelectronic components can be neatly partitioned into two nearly separate disciplines, the design of packaging for microsensors must be undertaken as an integral part of the overall sensor-package-instrument design. Three issues figure prominently: (1) sensors must interact with their environment (by definition): (2) conventional packaging methods do not necessarily provide the correct combination of device isolation (for reliability) and device access (to the environment); and (3) the package design can affect—even dominate—many aspects of sensor performance and reliability. This paper outlines an approach to package design for microsensors, and illustrates how the approach was used in the development of the flex-circuit ribbon-cable package for the commercial microdielectrometer sensor.