Chapter 1. Microsensor Packaging and System Partitioning

  1. William Smothers
  1. Stephen D. Senturia and
  2. Rosemary L. Smith

Published Online: 27 MAR 2008

DOI: 10.1002/9780470320419.ch1

14th Automotive Materials Conference: Ceramic Engineering and Science Proceedings, Volume 8, Issue 9/10

14th Automotive Materials Conference: Ceramic Engineering and Science Proceedings, Volume 8, Issue 9/10

How to Cite

Senturia, S. D. and Smith, R. L. (2008) Microsensor Packaging and System Partitioning, in 14th Automotive Materials Conference: Ceramic Engineering and Science Proceedings, Volume 8, Issue 9/10 (ed W. Smothers), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470320419.ch1

Author Information

  1. Microsystems Technology Labs, Dept. Electrical Eng. Massachusetts Institute of Technology Cambridge, MA 02139

Publication History

  1. Published Online: 27 MAR 2008
  2. Published Print: 1 JAN 1987

ISBN Information

Print ISBN: 9780470374740

Online ISBN: 9780470320419

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Keywords:

  • actuation;
  • amplification;
  • microsensor;
  • insulation;
  • trimmable

Summary

While the problem of packaging of conventional microelectronic components can be neatly partitioned into two nearly separate disciplines, the design of packaging for microsensors must be undertaken as an integral part of the overall sensor-package-instrument design. Three issues figure prominently: (1) sensors must interact with their environment (by definition): (2) conventional packaging methods do not necessarily provide the correct combination of device isolation (for reliability) and device access (to the environment); and (3) the package design can affect—even dominate—many aspects of sensor performance and reliability. This paper outlines an approach to package design for microsensors, and illustrates how the approach was used in the development of the flex-circuit ribbon-cable package for the commercial microdielectrometer sensor.