Chapter 2. Integrated Solid-State Sensors for Automated Manufacturing
- William Smothers
Published Online: 27 MAR 2008
Copyright © 1987 The American Ceramic Society, Inc.
14th Automotive Materials Conference: Ceramic Engineering and Science Proceedings, Volume 8, Issue 9/10
How to Cite
Wise, K. D. (1987) Integrated Solid-State Sensors for Automated Manufacturing, in 14th Automotive Materials Conference: Ceramic Engineering and Science Proceedings, Volume 8, Issue 9/10 (ed W. Smothers), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470320419.ch2
- Published Online: 27 MAR 2008
- Published Print: 1 JAN 1987
Print ISBN: 9780470374740
Online ISBN: 9780470320419
Sensors based on silicon process technology and containing integrated on-chip interface circuitry have begun to play a key role in automated manufacturing, where many low-cost, high-performance sensors are needed for in-process product monitoring and equipment control. This paper discusses recent progress in the development of integrated sensors and their possible evolution toward self-testing, addressable devices which offer high-level digital outputs and are digitally compensated. The current state of integrated sensors is illustrated by examining two structures: an 8 × 8-element tactile imager, and a 32-element linear thermal imaging array. The tactile device is based on a capacitive cell, with a no-load capacitance of 1.6 pF, an uncompensated resolution of more than eight bits, and an operating force range that can be scaled over several orders of magnitude without changing the process or lateral array dimensions. The thermal imager operates over a broad ambient temperature range, resolves target temperature differences of less than 0.2°C, and has an input dynamic range spanning nearly seven orders of magnitude.