Diffusion Bonding of Silicon Carbide for MEMS-LDI Applications

  1. Edgar Lara-Curzio,
  2. Jonathan Salem and
  3. Dongming Zhu
  1. Michael C. Halbig1,
  2. Mrityunjay Singh2,
  3. Tarah Shpargel3 and
  4. James D. Kiser4

Published Online: 14 DEC 2009

DOI: 10.1002/9780470339497.ch48

Mechanical Properties and Performance of Engineering Ceramics and Composites III

Mechanical Properties and Performance of Engineering Ceramics and Composites III

How to Cite

Halbig, M. C., Singh, M., Shpargel, T. and Kiser, J. D. (2007) Diffusion Bonding of Silicon Carbide for MEMS-LDI Applications, in Mechanical Properties and Performance of Engineering Ceramics and Composites III (eds E. Lara-Curzio, J. Salem and D. Zhu), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470339497.ch48

Author Information

  1. 1

    US. Army Research Laboratory, NASA Glenn Research Center, Cleveland, Ohio 44 135

  2. 2

    Ohio Aerospace Institute, NASA Glenn Research Center, Cleveland, Ohio 44135

  3. 3

    ASRC Aerospace Corporation, NASA Glenn Research Center, Cleveland, Ohio 44135

  4. 4

    NASA Glenn Research Center, Cleveland, Ohio 44135

Publication History

  1. Published Online: 14 DEC 2009
  2. Published Print: 29 OCT 2007

ISBN Information

Print ISBN: 9780470196335

Online ISBN: 9780470339497

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Keywords:

  • micro-electro-mechanical systems-lean direct injector;
  • leak free joints;
  • diffusion bonding;
  • physically vapor deposition;
  • silicon carbide

Summary

This chapter contains sections titled:

  • Introduction

  • Experimental

  • Results and Discussion

  • Conclusions

  • Acknowledgements