7. Evaluation on Thermo-Mechanical Integrity of Thermoelectric Module for Heat Recovery at Low Temperature

  1. Hua-Tay Lin,
  2. Kunihito Koumoto,
  3. Waltraud M. Kriven,
  4. Edwin Garcia,
  5. Ivar E. Reimanis and
  6. David P. Norton
  1. Yujiro Nakatani1,
  2. Takahiko Shindo1,
  3. Kengo Wakamatsu1,
  4. Takehisa Hino1,
  5. Takashi Ohishi1,
  6. Haruo Matsumuro2 and
  7. Yoshiyasu Itoh1

Published Online: 1 APR 2009

DOI: 10.1002/9780470456200.ch7

Developments in Strategic Materials: Ceramic Engineering and Science Proceedings, Volume 29, Issue 10

Developments in Strategic Materials: Ceramic Engineering and Science Proceedings, Volume 29, Issue 10

How to Cite

Nakatani, Y., Shindo, T., Wakamatsu, K., Hino, T., Ohishi, T., Matsumuro, H. and Itoh, Y. (2008) Evaluation on Thermo-Mechanical Integrity of Thermoelectric Module for Heat Recovery at Low Temperature, in Developments in Strategic Materials: Ceramic Engineering and Science Proceedings, Volume 29, Issue 10 (eds H.-T. Lin, K. Koumoto, W. M. Kriven, E. Garcia, I. E. Reimanis and D. P. Norton), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470456200.ch7

Author Information

  1. 1

    Power and Industrial Systems R&D Center, Toshiba Corporation, Yokohama, Japan

  2. 2

    New Business Promotion Department, Toshiba Corporation, Tokyo, Japan

Publication History

  1. Published Online: 1 APR 2009
  2. Published Print: 8 DEC 2008

Book Series:

  1. Ceramic Engineering and Science Proceedings

Book Series Editors:

  1. Tatsuki Ohji and
  2. Andrew Wereszczak

ISBN Information

Print ISBN: 9780470345009

Online ISBN: 9780470456200

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Keywords:

  • thermo-mechanical integrity;
  • thermoelectric module;
  • heat recovery;
  • thermoelectric efficiency;
  • finite element analysis

Summary

This chapter contains sections titled:

  • Abstract

  • Introduction

  • Experimental Details

  • Results and Discussion

  • Conclusion

  • Acknowledgments

  • References