Low-Temperature Fabrication of Highly Loaded Dielectric Films Made of Ceramic-Polymer Composites for 3D Integration

  1. K. M. Nair,
  2. D. Suvorov,
  3. R. W. Schwartz and
  4. R. Guo
  1. Jong-hee Kim,
  2. Eunhae Koo,
  3. Young Joon Yoon and
  4. Hyo Tae Kim

Published Online: 22 JUL 2009

DOI: 10.1002/9780470528990.ch2

Advances in Electroceramic Materials: Ceramic Transactions

Advances in Electroceramic Materials: Ceramic Transactions

How to Cite

Kim, J.-h., Koo, E., Yoon, Y. J. and Kim, H. T. (2009) Low-Temperature Fabrication of Highly Loaded Dielectric Films Made of Ceramic-Polymer Composites for 3D Integration, in Advances in Electroceramic Materials: Ceramic Transactions (eds K. M. Nair, D. Suvorov, R. W. Schwartz and R. Guo), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470528990.ch2

Publication History

  1. Published Online: 22 JUL 2009
  2. Published Print: 8 JUN 2009

ISBN Information

Print ISBN: 9780470408445

Online ISBN: 9780470528990

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Keywords:

  • dielectric films;
  • ceramic-polymer composites;
  • low-temperature fabrication;
  • ceramic packaging;
  • ink-jet printing

Summary

This chapter contains sections titled:

  • Introduction

  • Experimental Procedure

  • Results and Discussion

  • Summary

  • Acknowledgments