Adhesion Improvement of Hard Boron Nitride Films by Insertion of Various lnterlayers

  1. Sanjay Mathur,
  2. Mrityunjay Singh,
  3. Dileep Singh and
  4. Jonathan Salem
  1. Tetsutaro Ohori,
  2. Hiroki Asami,
  3. Jun Shirahata,
  4. Tsuneo Suzuki,
  5. Tadachika Nakayama,
  6. Hisayuki Suematsu and
  7. Koichi Niihara

Published Online: 14 JAN 2010

DOI: 10.1002/9780470584378.ch12

Nanostructured Materials and Nanotechnology III

Nanostructured Materials and Nanotechnology III

How to Cite

Ohori, T., Asami, H., Shirahata, J., Suzuki, T., Nakayama, T., Suematsu, H. and Niihara, K. (2009) Adhesion Improvement of Hard Boron Nitride Films by Insertion of Various lnterlayers, in Nanostructured Materials and Nanotechnology III (eds S. Mathur, M. Singh, D. Singh and J. Salem), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470584378.ch12

Author Information

Publication History

  1. Published Online: 14 JAN 2010
  2. Published Print: 9 NOV 2009

ISBN Information

Print ISBN: 9780470457573

Online ISBN: 9780470584378

SEARCH

Keywords:

  • adhesion improvement;
  • boron nitride films;
  • magnetron sputtering;
  • scanning electron microscopy;
  • chemical bonding

Summary

This chapter contains sections titled:

  • Introduction

  • Experimental Setup

  • Results and Discussion

  • Conclusion

  • References