2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces

  1. J. Paulo Davim and
  2. Mark J. Jackson
  1. Xiaoping Li

Published Online: 26 JAN 2010

DOI: 10.1002/9780470611807.ch2

Nano and Micromachining

Nano and Micromachining

How to Cite

Li, X. (2010) Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces, in Nano and Micromachining (eds J. P. Davim and M. J. Jackson), ISTE, London, UK. doi: 10.1002/9780470611807.ch2

Publication History

  1. Published Online: 26 JAN 2010
  2. Published Print: 1 JAN 2009

ISBN Information

Print ISBN: 9781848211032

Online ISBN: 9780470611807

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Keywords:

  • semiconductor wafer materials;
  • research groups;
  • ceramic materials;
  • global dynamic stress;
  • cubic structure

Summary

This chapter contains sections titled:

  • Introduction

  • The mechanism of ductile mode cutting of brittle materials

  • The chip formation in cutting of brittle materials

  • Machined surfaces in relation to chip formation mode

  • References