Chapter 2. Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces
- J. Paulo Davim,
- Mark J. Jackson
Published Online: 26 JAN 2010
DOI: 10.1002/9780470611807.ch2
Copyright © 2009 ISTE Ltd.
Book Title

Nano and Micromachining
Additional Information
How to Cite
Li, X. (2010) Ductile Mode Cutting of Brittle Materials: Mechanism, Chip Formation and Machined Surfaces, in Nano and Micromachining (eds J. P. Davim and M. J. Jackson), ISTE, London, UK. doi: 10.1002/9780470611807.ch2
Publication History
- Published Online: 26 JAN 2010
- Published Print: 1 JAN 2009
ISBN Information
Print ISBN: 9781848211032
Online ISBN: 9780470611807
- Summary
- Chapter
- References
Keywords:
- semiconductor wafer materials;
- research groups;
- ceramic materials;
- global dynamic stress;
- cubic structure
Summary
This chapter contains sections titled:
Introduction
The mechanism of ductile mode cutting of brittle materials
The chip formation in cutting of brittle materials
Machined surfaces in relation to chip formation mode
References
