Chapter 10. Grounding in PCBs

  1. Spartaco Caniggia1 and
  2. Francescaromana Maradei2

Published Online: 10 OCT 2008

DOI: 10.1002/9780470772874.ch10

Signal Integrity and Radiated Emission of High-Speed Digital Systems

Signal Integrity and Radiated Emission of High-Speed Digital Systems

How to Cite

Caniggia, S. and Maradei, F. (2008) Grounding in PCBs, in Signal Integrity and Radiated Emission of High-Speed Digital Systems, John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9780470772874.ch10

Author Information

  1. 1

    Italtel (retired) and Expert of Comitato Elettrotecnico Italiano (CEI), Italy

  2. 2

    Sapienza University of Rome, Italy

Publication History

  1. Published Online: 10 OCT 2008
  2. Published Print: 14 NOV 2008

ISBN Information

Print ISBN: 9780470511664

Online ISBN: 9780470772874

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Keywords:

  • electronic system grounding;
  • common-mode coupling;
  • shielded foil twisted-pair (SFTP);
  • PCB grounding;
  • noise calculation SPICE connector;
  • test connector transfer impedance measurement;
  • connector pin assignments;
  • EMC performance and shielded container

Summary

This chapter contains sections titled:

  • Common-Mode Coupling

  • Ground and Power Distribution in a Multilayer PCB

  • Grounding at PCB Connectors

  • Partitioning and Modeling

  • Points to Remember and Design Rules for Grounding in PCBs

  • References