40. Electronic Materials, Components, and Devices

  1. R. Winston Revie
  1. R. P. Frankenthal1 and
  2. L. F. Garfias-Mesias2

Published Online: 19 APR 2011

DOI: 10.1002/9780470872864.ch40

Uhlig's Corrosion Handbook, Third Edition

Uhlig's Corrosion Handbook, Third Edition

How to Cite

Frankenthal, R. P. and Garfias-Mesias, L. F. (2011) Electronic Materials, Components, and Devices, in Uhlig's Corrosion Handbook, Third Edition (ed R. W. Revie), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470872864.ch40

Editor Information

  1. CANMET Materials Technology Laboratory, Ottawa, Ontario, Canada

Author Information

  1. 1

    Bell Laboratories, Lucent Technologies, Murray Hill, New Jersey, USA

  2. 2

    DNV Columbus, Inc., Dublin, Ohio, USA

Publication History

  1. Published Online: 19 APR 2011
  2. Published Print: 28 MAR 2011

ISBN Information

Print ISBN: 9780470080320

Online ISBN: 9780470872864



  • electronic materials, components and devices - corrosion mechanisms, for failures in discrete active devices, as diodes or transistors;
  • very large scale integrated (VLSI) circuit manufacture - and multilevel metallizations and interconnections, using metal couples;
  • printed circuit boards (PCBs), simple as a single molded plastic board with copper conductors - one or both sides, or with layers of copper conductors


This chapter contains sections titled:

  • Introduction

  • Environment and contamination

  • Integrated circuits

  • Printed circuit boards

  • Hybrid integrated circuits (HICs) and multichip modules

  • Contacts and connectors

  • Other failures and failure mechanisms

  • References