40. Electronic Materials, Components, and Devices
- R. Winston Revie
Published Online: 19 APR 2011
DOI: 10.1002/9780470872864.ch40
Copyright © 2011 John Wiley & Sons, Inc.
Book Title

Uhlig's Corrosion Handbook, Third Edition
Additional Information
How to Cite
Frankenthal, R. P. and Garfias-Mesias, L. F. (2011) Electronic Materials, Components, and Devices, in Uhlig's Corrosion Handbook, Third Edition (ed R. W. Revie), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470872864.ch40
Editor Information
CANMET Materials Technology Laboratory, Ottawa, Ontario, Canada
Publication History
- Published Online: 19 APR 2011
- Published Print: 28 MAR 2011
Book Series:
ISBN Information
Print ISBN: 9780470080320
Online ISBN: 9780470872864
- Summary
- Chapter
- References
Keywords:
- electronic materials, components and devices - corrosion mechanisms, for failures in discrete active devices, as diodes or transistors;
- very large scale integrated (VLSI) circuit manufacture - and multilevel metallizations and interconnections, using metal couples;
- printed circuit boards (PCBs), simple as a single molded plastic board with copper conductors - one or both sides, or with layers of copper conductors
Summary
This chapter contains sections titled:
Introduction
Environment and contamination
Integrated circuits
Printed circuit boards
Hybrid integrated circuits (HICs) and multichip modules
Contacts and connectors
Other failures and failure mechanisms
References
