41. Corrosion of Electronics: Lead-Free Initiatives

  1. R. Winston Revie
  1. M. Reid1 and
  2. L. F. Garfias-Mesias2

Published Online: 19 APR 2011

DOI: 10.1002/9780470872864.ch41

Uhlig's Corrosion Handbook, Third Edition

Uhlig's Corrosion Handbook, Third Edition

How to Cite

Reid, M. and Garfias-Mesias, L. F. (2011) Corrosion of Electronics: Lead-Free Initiatives, in Uhlig's Corrosion Handbook, Third Edition (ed R. W. Revie), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470872864.ch41

Editor Information

  1. CANMET Materials Technology Laboratory, Ottawa, Ontario, Canada

Author Information

  1. 1

    Stokes Research Institute, University of Limerick, Limerick, Ireland

  2. 2

    DNV Columbus, Inc., Dublin, Ohio, USA

Publication History

  1. Published Online: 19 APR 2011
  2. Published Print: 28 MAR 2011

ISBN Information

Print ISBN: 9780470080320

Online ISBN: 9780470872864

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Keywords:

  • corrosion of electronics: lead-free initiatives;
  • lead-free solders, current alternatives - RoHS directives, moving towards environmentally green electronics;
  • ENIG and ENEPIG surface finish - electroless nickel immersion gold (ENIG), widely used in electronic industry, in military applications

Summary

This chapter contains sections titled:

  • Introduction

  • Lead-containing solders

  • Lead-free solders: current alternatives

  • Corrosion of alternative lead-free solders

  • Lead-free solders: creep and flux residues

  • Summary

  • References