Chapter 6. Processing Integrated Capacitors

  1. Richard K. Ulrich1 and
  2. Leonard W. Schaper2
  1. Richard K. Ulrich

Published Online: 23 FEB 2010

DOI: 10.1002/9780471722939.ch6

Integrated Passive Component Technology

Integrated Passive Component Technology

How to Cite

Ulrich, R. K. (2003) Processing Integrated Capacitors, in Integrated Passive Component Technology (eds R. K. Ulrich and L. W. Schaper), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780471722939.ch6

Editor Information

  1. 1

    Department of Chemical Engineering, University of Arkansas, Fayetteville, Arkansas, USA

  2. 2

    Department of Electrical Engineering, University of Arkansas, Fayetteville, Arkansa, USA

Author Information

  1. Department of Chemical Engineering, University of Arkansas, Fayetteville, Arkansas, USA

Publication History

  1. Published Online: 23 FEB 2010
  2. Published Print: 16 JUN 2003

ISBN Information

Print ISBN: 9780471244318

Online ISBN: 9780471722939

SEARCH

Keywords:

  • anodized films;
  • overlay of effects;
  • integrated capacitor applications

Summary

This chapter contains sections titled:

  • Sputtering

  • CVD, PECVD and MOCVD

  • Anodization

  • Sol-Gel and Hydrothermal Ferroelectrics

  • Thin- and Thick-Film Polymers

  • Thick-Film Dielectrics

  • Interlayer Insulation

  • Interdigitated Capacitors

  • Capacitor Plate Materials

  • Trimming Integrated Capacitors

  • Commercialized Integrated Capacitor Technologies

  • Summary

  • References