9. Enhancement of through-Thickness Thermal Conductivity in Adhesively Bonded Joints Using Aligned Carbon Nanotubes

  1. Sharmila M. Mukhopadhyay
  1. Sangwook Sihn1,
  2. Sabyasachi Ganguli1,
  3. Ajit K. Roy2,
  4. Liangti Qu3 and
  5. Liming Dai4

Published Online: 31 AUG 2011

DOI: 10.1002/9781118114063.ch9

Nanoscale Multifunctional Materials: Science and Applications

Nanoscale Multifunctional Materials: Science and Applications

How to Cite

Sihn, S., Ganguli, S., Roy, A. K., Qu, L. and Dai, L. (2011) Enhancement of through-Thickness Thermal Conductivity in Adhesively Bonded Joints Using Aligned Carbon Nanotubes, in Nanoscale Multifunctional Materials: Science and Applications (ed S. M. Mukhopadhyay), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9781118114063.ch9

Editor Information

  1. Center for Nanoscale Multifunctional Materials, Wright State University, Dayton, Ohio, USA

Author Information

  1. 1

    University of Dayton Research Institute, Dayton, Ohio, USA

  2. 2

    Air Force Research Laboratory, Wright-Patterson Air Force Base, Dayton, Ohio, USA

  3. 3

    Beijing Institute of Technology, Beijing, China

  4. 4

    Case Western Reserve University, Cleveland, Ohio, USA

Publication History

  1. Published Online: 31 AUG 2011
  2. Published Print: 1 AUG 2011

ISBN Information

Print ISBN: 9780470508916

Online ISBN: 9781118114063

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Keywords:

  • through-thickness thermal conductivity using aligned CNTs;
  • thermal diffusivity and laser-flash method;
  • thermal conductivity measurement

Summary

This chapter contains sections titled:

  • Introduction

  • Design of a Joint Configuration

  • Numerical Thermal Analysis

  • Experiments

  • Summary and Discussion