Composition Analysis of Diffusion Bonded y-TiAl Intermetallic: TiAlV Alloy Interface by Using STEM

  1. TMS
  1. P. Sivagnanapalani Gouthama1 and
  2. M Sujata2

Published Online: 18 MAY 2012

DOI: 10.1002/9781118356074.ch119

Supplemental Proceedings: Materials Processing and Interfaces, Volume 1

Supplemental Proceedings: Materials Processing and Interfaces, Volume 1

How to Cite

Gouthama, P. S. and Sujata, M. (2012) Composition Analysis of Diffusion Bonded y-TiAl Intermetallic: TiAlV Alloy Interface by Using STEM, in Supplemental Proceedings: Materials Processing and Interfaces, Volume 1 (ed TMS), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9781118356074.ch119

Author Information

  1. 1

    Electron Microscope Facility, Department of Materials Science and Engineering, Indian Institute of Technology, Kanpur-208016, India

  2. 2

    National Aerospace Laboratories, Council of Scientific and Industrial Research, Bangalore-566017, India

Publication History

  1. Published Online: 18 MAY 2012
  2. Published Print: 17 MAR 2012

ISBN Information

Print ISBN: 9781118296073

Online ISBN: 9781118356074

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Keywords:

  • Diffusion bonding;
  • Titanium aluminides;
  • Cross-sectional TEM;
  • STEM-EDS

Summary

This chapter contains sections titled:

  • Introduction

  • Materials and Experimental Procedure

  • Results and Discussion

  • Conclusions