Wettability and Interfacial Microstructure of Pb-Free Sn3.5Ag Alloy Powders on Cu Substrate

  1. TMS
  1. Jin Zhao1,2,
  2. WeiPeng Zhang1,2,
  3. TingTing Song1,2,
  4. YuLai Gao2 and
  5. Qüie Zhai2

Published Online: 7 JUN 2012

DOI: 10.1002/9781118357002.ch75

Supplemental Proceedings: Materials Properties, Characterization, and Modeling, Volume 2

Supplemental Proceedings: Materials Properties, Characterization, and Modeling, Volume 2

How to Cite

Zhao, J., Zhang, W., Song, T., Gao, Y. and Zhai, Q. (2012) Wettability and Interfacial Microstructure of Pb-Free Sn3.5Ag Alloy Powders on Cu Substrate, in Supplemental Proceedings: Materials Properties, Characterization, and Modeling, Volume 2 (ed TMS), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9781118357002.ch75

Author Information

  1. 1

    Laboratory for Microstructures, Shanghai University, 99 Shangda Road, Shanghai 200436, P. R., China

  2. 2

    School of Materials Science and Engineering, Shanghai University, 149 Yanchang Road, Shanghai 200072, P. R. China

Publication History

  1. Published Online: 7 JUN 2012
  2. Published Print: 17 MAR 2012

ISBN Information

Print ISBN: 9781118296097

Online ISBN: 9781118357002

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Keywords:

  • Wettability;
  • Interfacial microstructure;
  • Sn3;
  • 5Ag;
  • Contact angle;
  • Intermetallic;
  • compound

Summary

This chapter contains sections titled:

  • Introduction

  • Experimental Procedure

  • Results and Discussions

  • Conclusion

  • Acknowledgements