Microstructure Mediated Design of Material and Product

  1. Mei Li,
  2. Carelyn Campbell,
  3. Katsuyo Thornton,
  4. Elizabeth Holm and
  5. Peter Gumbsch
  1. Ayan Sinha1,
  2. Janet K. Allen2,
  3. Jitesh Pancha1 and
  4. Farrokh Mistree2

Published Online: 12 JUL 2013

DOI: 10.1002/9781118767061.ch7

2 World Congress on Integrated Computational Materials Engineering

2 World Congress on Integrated Computational Materials Engineering

How to Cite

Sinha, A., Allen, J. K., Pancha, J. and Mistree, F. (2013) Microstructure Mediated Design of Material and Product, in 2 World Congress on Integrated Computational Materials Engineering (eds M. Li, C. Campbell, K. Thornton, E. Holm and P. Gumbsch), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9781118767061.ch7

Author Information

  1. 1

    Department of Mechanical Engineering, Purdue University, West Lafayette, Indiana, USA

  2. 2

    The Systems Realization Laboratory@ OU, The University of Oklahoma, Norman, OK, USA

Publication History

  1. Published Online: 12 JUL 2013
  2. Published Print: 21 JUN 2013

ISBN Information

Print ISBN: 9781118766897

Online ISBN: 9781118767061

SEARCH

Options for accessing this content:

  • If you are a society or association member and require assistance with obtaining online access instructions please contact our Journal Customer Services team.
    http://wiley.force.com/Interface/ContactJournalCustomerServices_V2.
  • Login via other institutional login options http://onlinelibrary.wiley.com/login-options.
  • You can purchase online access to this Chapter for a 24-hour period (price varies by title)
    • If you already have a Wiley Online Library or Wiley InterScience user account: login above and proceed to purchase the article.
    • New Users: Please register, then proceed to purchase the article.

Login via OpenAthens

or

Search for your institution's name below to login via Shibboleth.

Please register to:

  • Save publications, articles and searches
  • Get email alerts
  • Get all the benefits mentioned below!

Register now >