1. Low-k Materials: Recent Advances

  1. Mikhail R. Baklanov3,
  2. Paul S. Ho4 and
  3. Ehrenfried Zschech5
  1. Geraud Dubois1 and
  2. Willi Volksen1,2

Published Online: 17 FEB 2012

DOI: 10.1002/9781119963677.ch1

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology

How to Cite

Dubois, G. and Volksen, W. (2012) Low-k Materials: Recent Advances, in Advanced Interconnects for ULSI Technology (eds M. R. Baklanov, P. S. Ho and E. Zschech), John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119963677.ch1

Editor Information

  1. 3

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

  2. 4

    Lab for Interconnect and Packaging, The University of Texas at Austin, UT-PRC 10100 Burnet Road, Bldg 160, Mail Code R8650, Austin, TX 78758, USA

  3. 5

    Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden Branch, Maria-Reiche-Strasse 2, 01109 Dresden, Germany

Author Information

  1. 1

    Hybrid Polymeric Materials Group, IBM Almaden Research Center, 650 Harry Road, K-17/E-1, San Jose, CA95120, USA

  2. 2

    Advanced Organic Materials Group, IBM Almaden Research Center, 650 Harry Road, K-17/E-1, San Jose, CA95120, USA

Publication History

  1. Published Online: 17 FEB 2012
  2. Published Print: 24 FEB 2012

ISBN Information

Print ISBN: 9780470662540

Online ISBN: 9781119963677

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