12. 3D Interconnect Technology
- Mikhail R. Baklanov3,
- Paul S. Ho4 and
- Ehrenfried Zschech5
Published Online: 17 FEB 2012
Copyright © 2012 John Wiley & Sons, Ltd
Advanced Interconnects for ULSI Technology
How to Cite
Knickerbocker, J. U., Kong, L. W., Niese, S., Diebold, A. and Zschech, E. (2012) 3D Interconnect Technology, in Advanced Interconnects for ULSI Technology (eds M. R. Baklanov, P. S. Ho and E. Zschech), John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119963677.ch12
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
Lab for Interconnect and Packaging, The University of Texas at Austin, UT-PRC 10100 Burnet Road, Bldg 160, Mail Code R8650, Austin, TX 78758, USA
Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden Branch, Maria-Reiche-Strasse 2, 01109 Dresden, Germany
- Published Online: 17 FEB 2012
- Published Print: 24 FEB 2012
Print ISBN: 9780470662540
Online ISBN: 9781119963677
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