12. 3D Interconnect Technology

  1. Mikhail R. Baklanov3,
  2. Paul S. Ho4 and
  3. Ehrenfried Zschech5
  1. John U. Knickerbocker1,
  2. Lay Wai Kong2,
  3. Sven Niese5,
  4. Alain Diebold2 and
  5. Ehrenfried Zschech5

Published Online: 17 FEB 2012

DOI: 10.1002/9781119963677.ch12

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology

How to Cite

Knickerbocker, J. U., Kong, L. W., Niese, S., Diebold, A. and Zschech, E. (2012) 3D Interconnect Technology, in Advanced Interconnects for ULSI Technology (eds M. R. Baklanov, P. S. Ho and E. Zschech), John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119963677.ch12

Editor Information

  1. 3

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

  2. 4

    Lab for Interconnect and Packaging, The University of Texas at Austin, UT-PRC 10100 Burnet Road, Bldg 160, Mail Code R8650, Austin, TX 78758, USA

  3. 5

    Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden Branch, Maria-Reiche-Strasse 2, 01109 Dresden, Germany

Author Information

  1. 1

    IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, NY 10598, USA

  2. 2

    College of Nanoscale Science and Engineering at the University at Albany, Albany, New York, USA

  3. 5

    Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden Branch, Maria-Reiche-Strasse 2, 01109 Dresden, Germany

Publication History

  1. Published Online: 17 FEB 2012
  2. Published Print: 24 FEB 2012

ISBN Information

Print ISBN: 9780470662540

Online ISBN: 9781119963677

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