14. Optical Interconnects

  1. Mikhail R. Baklanov2,
  2. Paul S. Ho3 and
  3. Ehrenfried Zschech4
  1. Wim Bogaerts

Published Online: 17 FEB 2012

DOI: 10.1002/9781119963677.ch14

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology

How to Cite

Bogaerts, W. (2012) Optical Interconnects, in Advanced Interconnects for ULSI Technology (eds M. R. Baklanov, P. S. Ho and E. Zschech), John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119963677.ch14

Editor Information

  1. 2

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

  2. 3

    Lab for Interconnect and Packaging, The University of Texas at Austin, UT-PRC 10100 Burnet Road, Bldg 160, Mail Code R8650, Austin, TX 78758, USA

  3. 4

    Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden Branch, Maria-Reiche-Strasse 2, 01109 Dresden, Germany

Author Information

  1. Ghent University – IMEC, Department of Information Technology, Ghent, Belgium

Publication History

  1. Published Online: 17 FEB 2012
  2. Published Print: 24 FEB 2012

ISBN Information

Print ISBN: 9780470662540

Online ISBN: 9781119963677

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Keywords:

  • (in order of importance): optical interconnects;
  • silicon photonics;
  • optical waveguides;
  • silicon modulators;
  • germanium photodetectors;
  • hybrid lasers;
  • photonic–electronic integration

Summary

We present possible technologies for on-chip optical interconnects integrated with electronics. We first describe the requirements for an optical link and the architectures that can be used for high-speed parallel optical links and optical networks on chip. We then give a more detailed overview of the optical building blocks, with a strong focus on silicon photonic implimentations: waveguides, wavelength (de)multiplexers, modulators, photodetectors and also the possibility of integrated lasers. Finally, we discuss the different options for integration of the photonic interconnect layers with electronics.