2. Ultra-Low-k by CVD: Deposition and Curing

  1. Mikhail R. Baklanov3,
  2. Paul S. Ho4 and
  3. Ehrenfried Zschech5
  1. Vincent Jousseaume1,
  2. Aziz Zenasni1,
  3. Olivier Gourhant2,
  4. Laurent Favennec2 and
  5. Mikhail R. Baklanov3

Published Online: 17 FEB 2012

DOI: 10.1002/9781119963677.ch2

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology

How to Cite

Jousseaume, V., Zenasni, A., Gourhant, O., Favennec, L. and Baklanov, M. R. (2012) Ultra-Low-k by CVD: Deposition and Curing, in Advanced Interconnects for ULSI Technology (eds M. R. Baklanov, P. S. Ho and E. Zschech), John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119963677.ch2

Editor Information

  1. 3

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

  2. 4

    Lab for Interconnect and Packaging, The University of Texas at Austin, UT-PRC 10100 Burnet Road, Bldg 160, Mail Code R8650, Austin, TX 78758, USA

  3. 5

    Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden Branch, Maria-Reiche-Strasse 2, 01109 Dresden, Germany

Author Information

  1. 1

    CEA-LETI, MINatec Campus, 17 rue des Martyrs, 38054 Grenoble Cedex 9, France

  2. 2

    STMicroelectronics, 850 rue Jean Monnet, 38921 Crolles, France

  3. 3

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

Publication History

  1. Published Online: 17 FEB 2012
  2. Published Print: 24 FEB 2012

ISBN Information

Print ISBN: 9780470662540

Online ISBN: 9781119963677

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