3. Plasma Processing of Low-k Dielectrics

  1. Mikhail R. Baklanov3,
  2. Paul S. Ho4,
  3. Ehrenfried Zschech5
  1. Hualiang Shi1,
  2. Denis Shamiryan2,
  3. Jean-François de Marneffe3,
  4. Huai Huang4,
  5. Paul S. Ho4,
  6. Mikhail R. Baklanov3

Published Online: 17 FEB 2012

DOI: 10.1002/9781119963677.ch3

Book Title

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology

Additional Information

How to Cite

Shi, H., Shamiryan, D., de Marneffe, J.-F., Huang, H., Ho, P. S. and Baklanov, M. R. (2012) Plasma Processing of Low-k Dielectrics, in Advanced Interconnects for ULSI Technology (eds M. R. Baklanov, P. S. Ho and E. Zschech), John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119963677.ch3

Editor Information

  1. 3

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

  2. 4

    Lab for Interconnect and Packaging, The University of Texas at Austin, UT-PRC 10100 Burnet Road, Bldg 160, Mail Code R8650, Austin, TX 78758, USA

  3. 5

    Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden Branch, Maria-Reiche-Strasse 2, 01109 Dresden, Germany

Author Information

  1. 1

    INTEL Corporation, Chandler, Arizona, USA

  2. 2

    GLOBALFOUNDRIES, Dresden Module One LLC & Co. KG, Wilschdorfer Landstrasse 101, 01109 Dresden, Germany

  3. 3

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

  4. 4

    Lab for Interconnect and Packaging, The University of Texas at Austin, UT-PRC 10100 Burnet Road, Bldg 160, Mail Code R8650, Austin, TX 78758, USA

Publication History

  1. Published Online: 17 FEB 2012
  2. Published Print: 24 FEB 2012

ISBN Information

Print ISBN: 9780470662540

Online ISBN: 9781119963677

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