5. Copper Electroplating for On-Chip Metallization
- Mikhail R. Baklanov2,
- Paul S. Ho3 and
- Ehrenfried Zschech4
Published Online: 17 FEB 2012
Copyright © 2012 John Wiley & Sons, Ltd
Advanced Interconnects for ULSI Technology
How to Cite
Dubin, V. M. (2012) Copper Electroplating for On-Chip Metallization, in Advanced Interconnects for ULSI Technology (eds M. R. Baklanov, P. S. Ho and E. Zschech), John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119963677.ch5
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
Lab for Interconnect and Packaging, The University of Texas at Austin, UT-PRC 10100 Burnet Road, Bldg 160, Mail Code R8650, Austin, TX 78758, USA
Fraunhofer Institute for Non-Destructive Testing IZFP, Dresden Branch, Maria-Reiche-Strasse 2, 01109 Dresden, Germany
- Published Online: 17 FEB 2012
- Published Print: 24 FEB 2012
Print ISBN: 9780470662540
Online ISBN: 9781119963677
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