18. Influence of Miniaturization on Mechanical Reliability of Lead-Free Solder Interconnects
- K. N. Subramanian
Published Online: 15 MAR 2012
DOI: 10.1002/9781119966203.ch18
Copyright © 2012 John Wiley & Sons, Ltd
Book Title
Lead-Free Solders: Materials Reliability for Electronics
Additional Information
How to Cite
Khatibi, G., Ipser, H., Lederer, M. and Weiss, B. (2012) Influence of Miniaturization on Mechanical Reliability of Lead-Free Solder Interconnects, in Lead-Free Solders: Materials Reliability for Electronics (ed K. N. Subramanian), John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119966203.ch18
Editor Information
Department of Chemical Engineering and Materials Science, Michigan State University, Michigan, USA
Publication History
- Published Online: 15 MAR 2012
- Published Print: 6 MAR 2012
Book Series:
Book Series Editors:
- Arthur Willoughby4,
- Peter Capper5,
- Safa Kasap6
Series Editor Information
- 4
University of Southampton, Southampton, UK
- 5
SELEX Galileo Infrared Ltd., Southampton, UK
- 6
University of Saskatchewan, Canada
ISBN Information
Print ISBN: 9780470971826
Online ISBN: 9781119966203
- Summary
- Chapter
- References
Keywords:
- lead-free reliability;
- miniaturization;
- solder joint, integrity;
- solder alloy reliability;
- miniaturization;
- tensile and shear;
- IMC, fracture morphology;
- constraints and effects
Summary
This chapter contains sections titled:
Introduction
Effect of Miniaturization on Static Properties of Solder Joints (Tensile and Shear)
Creep and Relaxation of Solder Joints
Summary and Conclusions
Acknowledgments
References