6. Case Studies

  1. Marius Bâzu1 and
  2. Titu Băjenescu2

Published Online: 26 APR 2011

DOI: 10.1002/9781119990093.ch6

Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems

Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems

How to Cite

Bâzu, M. and Băjenescu, T. (2011) Case Studies, in Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems, John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119990093.ch6

Author Information

  1. 1

    National Institute for Microtechnologies, IMT-Bucharest, Romania

  2. 2

    C. F. C., Switzerland

Publication History

  1. Published Online: 26 APR 2011
  2. Published Print: 15 APR 2011

ISBN Information

Print ISBN: 9780470748244

Online ISBN: 9781119990093

SEARCH

Keywords:

  • bipolar technologies;
  • chip-scale packages (CSPs);
  • failure analysis (FA);
  • metal-oxide semiconductor (MOS) technologies;
  • microsystem technologies;
  • non-silicon technologies;
  • photonic technologies;
  • printed circuit boards (PCBs)

Summary

This chapter presents twelve case studies on the failure analysis (FA) of electronic components and systems. These case studies offer practical examples of the use of FA techniques in identifying failure mechanisms (FMs) by starting from the failure modes (FMos). The case studies cover a broad range of electronic components, starting with passive components and continuing with active electronic components fabricated by bipolar technologies (insulated gate bipolar transistors (IGBTs)), metal-oxide semiconductor (MOS) technologies, (complementary metal-oxide semiconductor (CMOS), microcomputer and metal-oxide semiconductor field-effect transistor (MOSFET)). It also covers photonic technologies (thin-film transistors (TFTs)), non-silicon technologies (heterojunction field effect transistors (HFETs)) and microsystem technologies (resonators, micro-cantilevers, magnetic and nonmagnetic switches). The last two case studies cover packages issues (for a modern solution, chip-scale packages (CSPs)) and the mounting of electronic components on printed circuit boards (PCBs) to fabricate electronic systems.

Controlled Vocabulary Terms

failure analysis; high electron mobility transistors; insulated gate bipolar transistors; micromechanical devices; MIS devices; organic thin film transistors; printed circuits