7. Conclusions

  1. Marius Bâzu1 and
  2. Titu Băjenescu2

Published Online: 26 APR 2011

DOI: 10.1002/9781119990093.ch7

Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems

Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems

How to Cite

Bâzu, M. and Băjenescu, T. (2011) Conclusions, in Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems, John Wiley & Sons, Ltd, Chichester, UK. doi: 10.1002/9781119990093.ch7

Author Information

  1. 1

    National Institute for Microtechnologies, IMT-Bucharest, Romania

  2. 2

    C. F. C., Switzerland

Publication History

  1. Published Online: 26 APR 2011
  2. Published Print: 15 APR 2011

ISBN Information

Print ISBN: 9780470748244

Online ISBN: 9781119990093

SEARCH

Keywords:

  • failure analysis (FA);
  • failure mechanisms (FMs);
  • physics-of- failure (PoF)

Summary

The historical development of reliability as a discipline allows the understanding of the significant role of failure analysis (FA), a role that has increased in recent years, since the physics-of- failure (PoF) has become an essential component of any reliability analysis. The state of the art in FA is described with three main strands: (i) techniques of FA; (ii) failure mechanisms (FMs); and (iii) models for the PoF. The new trends in FA are linked to device shrinking and complexity growing, from the current domain of microtechnology, towards a new domain, called nanotechnology, with new tools and models for FA, most of them not yet developed. In all these possible FAs, the manufacturer of the electronic components has to be involved, not to execute the analysis, but to promptly furnish explanations of results and comments on the way the FA was conducted.

Controlled Vocabulary Terms

failure analysis; fault trees; nanotechnology