Chapter 2. Material Characterization

  1. Prof. Dr. O. Brand2 and
  2. Dr. G. K. Fedder3
  1. O. Paul and
  2. P. Ruther

Published Online: 29 FEB 2008

DOI: 10.1002/9783527616718.ch2

CMOS - MEMS

CMOS - MEMS

How to Cite

Paul, O. and Ruther, P. (2005) Material Characterization, in CMOS - MEMS (eds O. Brand and G. K. Fedder), Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527616718.ch2

Editor Information

  1. 2

    School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0250, USA

  2. 3

    ECE Department & The Robotics Institute, Carnegie Mellon, University, Pittsburgh, PA 15213-3890, USA

Author Information

  1. IMTEK Institute of Microsystem Technology, University of Freiburg, Germany

Publication History

  1. Published Online: 29 FEB 2008
  2. Published Print: 26 JAN 2005

ISBN Information

Print ISBN: 9783527310807

Online ISBN: 9783527616718

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Keywords:

  • material property;
  • material parameter;
  • complementary metal oxide semiconductor;
  • thin film;
  • microelectromechanical system;
  • microsystem;
  • characterization method;
  • measurement technique;
  • process dependence;
  • electrical resistivity;
  • thermopower;
  • seebeck coefficient;
  • thermal conductivity;
  • heat capacity;
  • specific heat;
  • elastic modulus;
  • young's modulus;
  • poisson's ratio;
  • thermal expansion coefficient;
  • piezoresistive coefficient;
  • fracture strength;
  • fracture toughness

Summary

This chapter contains sections titled:

  • Introduction

  • Electrical and Thermoelectric Properties

  • Thermal Properties

  • Mechanical Properties

  • Conclusion

  • References