Chapter 2. Momentum and Heat Transfer in Microsized Devices

  1. Dr.-Ing. Norbert Kockmann
  1. Heinz Herwig

Published Online: 29 FEB 2008

DOI: 10.1002/9783527616749.ch2

Micro Process Engineering: Fundamentals, Devices, Fabrication, and Applications

Micro Process Engineering: Fundamentals, Devices, Fabrication, and Applications

How to Cite

Herwig, H. (2006) Momentum and Heat Transfer in Microsized Devices, in Micro Process Engineering: Fundamentals, Devices, Fabrication, and Applications (ed N. Kockmann), Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527616749.ch2

Editor Information

  1. Laboratory for Design of Microsystems, University of Freiburg-IMTEK, Georges-Köhler-Allee 102, 79110 Freiburg, Germany

Author Information

  1. Technische Thermodynamik, Technische Universität Hamburg-Harburg, Hamburg, Germany

Publication History

  1. Published Online: 29 FEB 2008
  2. Published Print: 6 FEB 2006

ISBN Information

Print ISBN: 9783527312467

Online ISBN: 9783527616749

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Keywords:

  • microsized devices;
  • dimensional analysis;
  • scaling effects;
  • variable properties;
  • entropy generation

Summary

This chapter contains sections titled:

  • Introduction

  • Dimensional Analysis and Scaling Effects

  • Basic Equations in Microsized Devices

  • Basic Equations in Microsized Slender Channels

  • Streamtube Approximations (1-D)

  • Heat Transfer in Microsized Devices

  • Entropy Generation