Chapter 2. Historical Motivations for CMP

  1. Joseph M. Steigerwald,
  2. Shyam P. Murarka and
  3. Ronald J. Gutmann

Published Online: 21 DEC 2007

DOI: 10.1002/9783527617746.ch2

Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials

How to Cite

Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J. (1997) Historical Motivations for CMP, in Chemical Mechanical Planarization of Microelectronic Materials, Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527617746.ch2

Publication History

  1. Published Online: 21 DEC 2007
  2. Published Print: 18 FEB 1997

ISBN Information

Print ISBN: 9780471138273

Online ISBN: 9783527617746

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Keywords:

  • semiconductor;
  • advanced metallization schemes;
  • dimensions;
  • interconnect delay;
  • metallization

Summary

This chapter contains sections titled:

  • Advanced Metallization Schemes

  • Planarization Schemes

  • CMP Planarization