Chapter 4. Mechanical and Electrochemical Concepts for CMP

  1. Joseph M. Steigerwald,
  2. Shyam P. Murarka and
  3. Ronald J. Gutmann

Published Online: 21 DEC 2007

DOI: 10.1002/9783527617746.ch4

Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials

How to Cite

Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J. (1997) Mechanical and Electrochemical Concepts for CMP, in Chemical Mechanical Planarization of Microelectronic Materials, Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527617746.ch4

Publication History

  1. Published Online: 21 DEC 2007
  2. Published Print: 18 FEB 1997

ISBN Information

Print ISBN: 9780471138273

Online ISBN: 9783527617746

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Keywords:

  • pad-slurry-wafer system;
  • preston equation;
  • mechanical properties;
  • lubricating liquid;
  • tribology

Summary

This chapter contains sections titled:

  • Preston Equation

  • Fluid Layer Interactions

  • Boundary Layer Interactions

  • Abrasion Modes

  • The Polishing Pad

  • Electrochemical Phenomena

  • Role of Chemistry in CMP

  • Abrasives