Chapter 5. Oxide CMP Processes Mechanisms and Models
Published Online: 21 DEC 2007
Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA
Chemical Mechanical Planarization of Microelectronic Materials
How to Cite
Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J. (1997) Oxide CMP Processes Mechanisms and Models, in Chemical Mechanical Planarization of Microelectronic Materials, Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527617746.ch5
- Published Online: 21 DEC 2007
- Published Print: 18 FEB 1997
Print ISBN: 9780471138273
Online ISBN: 9783527617746
Options for accessing this content:
- If you are a society or association member and require assistance with obtaining online access instructions please contact our Journal Customer Services team.
- Login via other institutional login options http://onlinelibrary.wiley.com/login-options.
- You can purchase online access to this Chapter for a 24-hour period (price varies by title)
- If you already have a Wiley Online Library or Wiley InterScience user account: login above and proceed to purchase the article.
- New Users: Please register, then proceed to purchase the article.
Login via OpenAthens
Search for your institution's name below to login via Shibboleth.
Registered Users please login:
- Access your saved publications, articles and searches
- Manage your email alerts, orders and subscriptions
- Change your contact information, including your password
Please register to:
- Save publications, articles and searches
- Get email alerts
- Get all the benefits mentioned below!