Chapter 5. Oxide CMP Processes Mechanisms and Models

  1. Joseph M. Steigerwald,
  2. Shyam P. Murarka and
  3. Ronald J. Gutmann

Published Online: 21 DEC 2007

DOI: 10.1002/9783527617746.ch5

Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials

How to Cite

Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J. (2007) Oxide CMP Processes Mechanisms and Models, in Chemical Mechanical Planarization of Microelectronic Materials, Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527617746.ch5

Publication History

  1. Published Online: 21 DEC 2007
  2. Published Print: 18 FEB 1997

ISBN Information

Print ISBN: 9780471138273

Online ISBN: 9783527617746

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Keywords:

  • CMP process;
  • planarization;
  • lithography;
  • glass polishing;
  • chemical mechanism

Summary

This chapter contains sections titled:

  • The Role of Chemistry in Oxide Polishing

  • Oxide CMP in Practice

  • summary