Chapter 6. TUNGSTEN CMP PROCESSES

  1. Joseph M. Steigerwald,
  2. Shyam P. Murarka and
  3. Ronald J. Gutmann

Published Online: 21 DEC 2007

DOI: 10.1002/9783527617746.ch6

Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials

How to Cite

Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J. (1997) TUNGSTEN CMP PROCESSES, in Chemical Mechanical Planarization of Microelectronic Materials, Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527617746.ch6

Publication History

  1. Published Online: 21 DEC 2007
  2. Published Print: 18 FEB 1997

ISBN Information

Print ISBN: 9780471138273

Online ISBN: 9783527617746

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Keywords:

  • RIE processes;
  • tungsten;
  • insulator surface;
  • interconnection;
  • metallization

Summary

This chapter contains sections titled:

  • Inlaid Metal Patterning

  • Tungsten CMP

  • Summary