Chapter 7. Copper CMP
Published Online: 21 DEC 2007
Copyright © 2004 WILEY-VCH Verlag GmbH & Co. KGaA
Chemical Mechanical Planarization of Microelectronic Materials
How to Cite
Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J. (1997) Copper CMP, in Chemical Mechanical Planarization of Microelectronic Materials, Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527617746.ch7
- Published Online: 21 DEC 2007
- Published Print: 18 FEB 1997
Print ISBN: 9780471138273
Online ISBN: 9783527617746
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