Chapter 8. CMP of Other Materials and New CMP Applications

  1. Joseph M. Steigerwald,
  2. Shyam P. Murarka and
  3. Ronald J. Gutmann

Published Online: 21 DEC 2007

DOI: 10.1002/9783527617746.ch8

Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials

How to Cite

Steigerwald, J. M., Murarka, S. P. and Gutmann, R. J. (2007) CMP of Other Materials and New CMP Applications, in Chemical Mechanical Planarization of Microelectronic Materials, Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527617746.ch8

Publication History

  1. Published Online: 21 DEC 2007
  2. Published Print: 18 FEB 1997

ISBN Information

Print ISBN: 9780471138273

Online ISBN: 9783527617746

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Keywords:

  • very-large-scale integration (VLSI);
  • dielectric constant materials;
  • polysilicon;
  • capacitor;
  • topography

Summary

This chapter contains sections titled:

  • The Front-End Applications in Silicon IC Fabrication

  • Planarizing A1 and A1 Alloys

  • Planarization of Diffusion Barriers/Adhesion Promoters

  • CMP of Advanced Interlevel Dielectric Materials: Polymers

  • Other Applications