Chapter 66. Silicon-Containing Spacers for the Synthesis of Tin-Containing Multidentate Lewis Acids

  1. Prof. Norbert Auner2 and
  2. Prof. Johann Weis3
  1. Reiner Altmann,
  2. Olivier Gausset,
  3. Reinhard Hummeltenberg,
  4. Klaus Jurkschat,
  5. Silke Kühn,
  6. Markus Schürmann and
  7. Bernhard Zobel

Published Online: 28 APR 2008

DOI: 10.1002/9783527619917.ch66

Organosilicon Chemistry IV: From Molecules to Materials

Organosilicon Chemistry IV: From Molecules to Materials

How to Cite

Altmann, R., Gausset, O., Hummeltenberg, R., Jurkschat, K., Kühn, S., Schürmann, M. and Zobel, B. (2000) Silicon-Containing Spacers for the Synthesis of Tin-Containing Multidentate Lewis Acids, in Organosilicon Chemistry IV: From Molecules to Materials (eds N. Auner and J. Weis), Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527619917.ch66

Editor Information

  1. 2

    Inst. für Anorganische Chemie, der Universität Frankfurt, Marie-Curie-Strasse 11, D-60439 Frankfurt am Main, Germany, Phone: 0 69/7 98-29180, -29591, Fax: 069/798-29188

  2. 3

    Wacker-Chemie GmbH, Geschäftsbereich S, Werk Burghausen, Johannes-Hess-Strasse 24, D-84489 Burghausen, Germany

Author Information

  1. Fachbereich Chemie, Lehrstuhl für Anorganische Chemie II Universität Dortmund D-44221 Dortmund, Germany Tel.: Int. code + (231)755 3800 — Fax: Int. code + (231)755 3797

Publication History

  1. Published Online: 28 APR 2008
  2. Published Print: 17 JAN 2000

ISBN Information

Print ISBN: 9783527298549

Online ISBN: 9783527619917

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Keywords:

  • silicon-containing rings;
  • tin-containing rings;
  • ferrocenophane;
  • lewis acids

Summary

Silicon- and tin-containing rings hold potential as reagents for selective anion recognition. In this paper the syntheses and structures of the new rings 1–4, 8–15, and of the cyclophane 16 are presented. In these compounds the tin atoms are bridged via silicon-containing spacers. Also reported are the syntheses and structures of the novel tin- and silicon-containing ferrocenophanes 19–22.