Chapter 110. Preparation and Properties of Porous Hybrids Silicone Resin for Interlayer Dielectronic Application

  1. Prof. Dr. Norbert Auner2 and
  2. Prof. Dr. Johann Weis3
  1. P. M. Chevalier,
  2. D. L. Ou,
  3. I. Mackinnon,
  4. K. Eguchi,
  5. R. Boisvert and
  6. K. Su

Published Online: 5 MAY 2008

DOI: 10.1002/9783527619924.ch110

Organosilicon Chemistry V: From Molecules to Materials

Organosilicon Chemistry V: From Molecules to Materials

How to Cite

Chevalier, P. M., Ou, D. L., Mackinnon, I., Eguchi, K., Boisvert, R. and Su, K. (2003) Preparation and Properties of Porous Hybrids Silicone Resin for Interlayer Dielectronic Application, in Organosilicon Chemistry V: From Molecules to Materials (eds N. Auner and J. Weis), Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527619924.ch110

Editor Information

  1. 2

    Department of Inorganic Chemistry, University of Frankfurt, Marie-Curie-Straße 11, 60439 Frankfurt am Main, Germany

  2. 3

    Consortium of Electrochemical Industry GmbH, Zielstattstraße 20, 81379 Munich, Germany

Author Information

  1. New Venture R&D, Dow Corning Ltd., Barry, CF63 2YL, UK Tel: +44 1446 723 504 — Fax: +44 1446 730 495

Publication History

  1. Published Online: 5 MAY 2008
  2. Published Print: 26 SEP 2003

ISBN Information

Print ISBN: 9783527306701

Online ISBN: 9783527619924

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Keywords:

  • silicone resin;
  • porosity;
  • dielectric constant;
  • low k;
  • modulus

Summary

Silicon oxide dielectric films have traditionally been used in microelectronic fabrication for integrated circuits having dielectric constants (k) near 4.0. However, as the feature size has been continuously scaling down, the relatively high k of such silicon oxide films have become inadequate to provide efficient electrical insulation. As such, there has been an increasing market demand for materials with an even lower dielectric constant for Interlayer Dielectric (IL d) applications, yet retaining thermal and mechanical integrity. We report our investigations on the preparation of ILD materials using a sacrificial approach whereby organic groups are burnt out to generate low-porous silicone resin films. We have been able to prepare a variety of hybrid silicone resin compositions leading to highly microporous thin films, exhibiting ultra-low k from 1.8 to 2.9, and good to high modulus, 1.5 to 5.5 GPa. Structure-property influences on porosity, dielectric constant and modulus are discussed.