Chapter 11. Integrated Circuit Packaging

  1. Prof. Kenneth A. Jackson2 and
  2. Prof. Dr. Wolfgang Schröter3
  1. Daniel I. Amey

Published Online: 28 MAY 2008

DOI: 10.1002/9783527621828.ch11

Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2

Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2

How to Cite

Amey, D. I. (2000) Integrated Circuit Packaging, in Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2 (eds K. A. Jackson and W. Schröter), Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527621828.ch11

Editor Information

  1. 2

    The University of Arizona, Arizona Materials Laboratory, 4715 E. Fort Lowell Road, Tucson, AZ 85712, USA

  2. 3

    IV. Physikalisches Institut der Georg-August-Universität Göttingen, Bunsenstraße 13–15, D-37073 Göttingen, Germany

Author Information

  1. E. I. DuPont de Nemours Inc., Dupont Electronic Materials, Wilmington, DE, U.S.A.

Publication History

  1. Published Online: 28 MAY 2008
  2. Published Print: 27 JUN 2000

ISBN Information

Print ISBN: 9783527298358

Online ISBN: 9783527621828

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Keywords:

  • electronic system;
  • multichip modules;
  • metallic particles;
  • X-rays

Summary

The chapter contains sections titled:

  • Introduction

  • Package Functions

  • Integrated Circuit Processing

  • Die Attachment

  • Microinterconnect Methods

  • Wire Bonding

  • Tape Automated Bonding (TAB)

  • Flip Chip or Solder Bump

  • Package Sealing

  • Rent's Rule

  • Thermal Management

  • Package Types

  • JEDEC

  • Package Attachment

  • Electrical Considerations

  • Other Package Selection Considerations

  • Cost

  • Multichip Modules

  • Change and Repair

  • Change Bars

  • Repair Links

  • The Future

  • References