Chapter 12. Interconnection Systems

  1. Prof. Kenneth A. Jackson2 and
  2. Prof. Dr. Wolfgang Schröter3
  1. Wulf Knausenberger

Published Online: 28 MAY 2008

DOI: 10.1002/9783527621828.ch12

Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2

Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2

How to Cite

Knausenberger, W. (2008) Interconnection Systems, in Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2 (eds K. A. Jackson and W. Schröter), Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527621828.ch12

Editor Information

  1. 2

    The University of Arizona, Arizona Materials Laboratory, 4715 E. Fort Lowell Road, Tucson, AZ 85712, USA

  2. 3

    IV. Physikalisches Institut der Georg-August-Universität Göttingen, Bunsenstraße 13–15, D-37073 Göttingen, Germany

Author Information

  1. RD Hikuai, via Thames, New Zealand Formerly of AT&T Bell Laboratories

Publication History

  1. Published Online: 28 MAY 2008
  2. Published Print: 27 JUN 2000

ISBN Information

Print ISBN: 9783527298358

Online ISBN: 9783527621828

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Keywords:

  • electronic product;
  • technology elements;
  • photonic technologies;
  • mainframe computer

Summary

The chapter contains sections titled:

  • Perspective

  • Interconnection Technology Trends and Drivers

  • Interconnection Hierarchy

  • Partitioning

  • Multichip Modules

  • Printed Wiring Board (PWB) Technology

  • Future Directions

  • References