Chapter 6. Etching Processes in Semiconductor Manufacturing

  1. Prof. Kenneth A. Jackson4 and
  2. Prof. Dr. Wolfgang Schröter5
  1. Kevin G. Oonohoe1,
  2. Terry Turner2 and
  3. Kenneth A. Jackson3

Published Online: 28 MAY 2008

DOI: 10.1002/9783527621828.ch6

Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2

Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2

How to Cite

Oonohoe, K. G., Turner, T. and Jackson, K. A. (2000) Etching Processes in Semiconductor Manufacturing, in Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2 (eds K. A. Jackson and W. Schröter), Wiley-VCH Verlag GmbH, Weinheim, Germany. doi: 10.1002/9783527621828.ch6

Editor Information

  1. 4

    The University of Arizona, Arizona Materials Laboratory, 4715 E. Fort Lowell Road, Tucson, AZ 85712, USA

  2. 5

    IV. Physikalisches Institut der Georg-August-Universität Göttingen, Bunsenstraße 13–15, D-37073 Göttingen, Germany

Author Information

  1. 1

    Formerly with Applied Materials, Santa Clara, CA, U.S.A.

  2. 2

    Fourth State Technology, Austin, TX, U.S.A.

  3. 3

    Arizona Materials Laboratory, University of Arizona, Tucson, AZ, U.S.A.

Publication History

  1. Published Online: 28 MAY 2008
  2. Published Print: 27 JUN 2000

ISBN Information

Print ISBN: 9783527298358

Online ISBN: 9783527621828

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Keywords:

  • laser interferometry;
  • boron phosphorus;
  • polycrystalline silicon;
  • aluminum

Summary

The chapter contains sections titled:

  • Introduction

  • Equipment: Description of Hardware

  • Endpoint, Diagnostic and Control Techniques

  • Process Discussion: General Considerations

  • Etch Processing for 4Mb DRAM

  • Summary

  • References