Chapter 4. Hot Embossing of LIGA Microstructures

  1. Prof. Dr. Volker Saile2,3,
  2. Prof. Dr. Ulrike Wallrabe4,
  3. Prof. Dr. Osamu Tabata5,6 and
  4. Prof. Dr. Jan G. Korvink7,8
  1. Mathias Heckele and
  2. Matthias Worgull

Published Online: 5 AUG 2009

DOI: 10.1002/9783527622573.ch4

LIGA and Its Applications

LIGA and Its Applications

How to Cite

Heckele, M. and Worgull, M. (2008) Hot Embossing of LIGA Microstructures, in LIGA and Its Applications (eds V. Saile, U. Wallrabe, O. Tabata and J. G. Korvink), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany. doi: 10.1002/9783527622573.ch4

Editor Information

  1. 2

    Institut für Mikrostrukturtechnik, Forschungszentrum Karlsruhe, Hermann-von-Helmholtz-Platz 1, 76344 Eggenstein-Leopoldshafen, Germany

  2. 3

    Universität Karlsruhe and Forschungszentum Karlsruhe, Institut für Mikrostrukturtechnik, 76021 Karlsruhe, Germany

  3. 4

    Universität Freiburg, Iustitut für Mikrosystemtechnik Arbeitsgruppe Mikroaktorik, Georges-Köhler-Allee 102, 79110 Freiburg, Germany

  4. 5

    Kyoto University, Graduate School of Engineering, Department of Micro Engineering, Yoshida-Honmachi, Sakyo-ku, Kyoto 606-8501, Japan

  5. 6

    Department of Mechanical Engineering, Kyoto University, Yoshida Honmachi Sakyo-ku, 606-8501 Kyoto, Japan

  6. 7

    Institute for Microsystem Technology (IMTEK), Albert-Ludwigs-Universität Freiburg, Georges-Köhler-Allee 103, 79110 Freiburg, Germany

  7. 8

    Laboratory for Design of Microsystems, University of Freiburg–IMTEK, Georges-Köhler-Allee 102, 79110 Freiburg, Germany

Author Information

  1. Forschungszentum Karlsruhe, Institut für Mikrostrukturtechnik, 76021 Karlsruhe, Germany

Publication History

  1. Published Online: 5 AUG 2009
  2. Published Print: 26 NOV 2008

Book Series:

  1. Advanced Micro and Nanosystems

Book Series Editors:

  1. Oliver Brand9,
  2. Prof. Dr. Gary K. Fedder10,
  3. Prof. Dr. Christopher Hierold11,
  4. Prof. Dr. Jan G. Korvink8 and
  5. Prof. Dr. Osamu Tabata6

Series Editor Information

  1. 6

    Department of Mechanical Engineering, Kyoto University, Yoshida Honmachi Sakyo-ku, 606-8501 Kyoto, Japan

  2. 8

    Laboratory for Design of Microsystems, University of Freiburg–IMTEK, Georges-Köhler-Allee 102, 79110 Freiburg, Germany

  3. 9

    School of Electrical and Computer Engineering, Georgia Institute of Technology, 777 Atlantic Drive, Atlanta, GA 30332-0250, USA

  4. 10

    ECE Department & Robotics Institute, Carnegie Mellon University, Pittsburgh, PA 15213-3890, USA

  5. 11

    Chair of Micro- and Nanosystems, ETH Zürich, ETH Zentrum, CLA H9, Tannenstrasse 3, 8092 Zürich, Switzerland

ISBN Information

Print ISBN: 9783527316984

Online ISBN: 9783527622573

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Keywords:

  • hot embossing;
  • LIGA;
  • replication;
  • mold inserts;
  • simulation

Summary

This chapter contains sections titled:

  • Introduction

  • Hot Embossing

  • Simulation

  • Applications

  • Plant Technology

  • Summary and Outlook

  • References