4. Stretchable Thin-Film Electronics

  1. Prof. Takao Someya
  1. Stéphanie P. Lacour

Published Online: 28 DEC 2012

DOI: 10.1002/9783527646982.ch4

Stretchable Electronics

Stretchable Electronics

How to Cite

Lacour, S. P. (2012) Stretchable Thin-Film Electronics, in Stretchable Electronics (ed T. Someya), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany. doi: 10.1002/9783527646982.ch4

Editor Information

  1. The University of Tokyo, Department of Electrical Engineering and Information Systems, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan

Author Information

  1. Center for Neuroprosthetics, EPFL | STI | IMT/IBI | LSBI, Station 17, CH-1015 Lausanne, Switzerland

Publication History

  1. Published Online: 28 DEC 2012
  2. Published Print: 19 DEC 2012

ISBN Information

Print ISBN: 9783527329786

Online ISBN: 9783527646982



  • cross-linked elastomers;
  • coefficient of thermal expansion (CTE);
  • polyimide (PI);
  • silicone elastomer;
  • microcracks;
  • microelectrode arrays


Making stretchable thin-film electronics presents considerable scientific and technological challenges: (i) Can substrates that are inherently extensible support reliable fabrication of thin-film conductor and semiconductor devices? (ii) Can device materials withstand mechanical deformations without compromising their electrical properties? and (iii) Which applications will be enabled with such ultracompliant electronic skins? This chapter illustrates those challenges and potential routes to overcome them. Section 4.2 reviews the physical properties of silicone rubber – the substrate hosting the thin-film devices. Section 4.3 describes the mechanical design to implement and use robust stretchable thin-film circuits. Section 4.4 reviews materials and characteristics of stretchable metallization. Section 4.5 highlights examples of stretchable thin-film devices.