8. Technologies and Processes Used in Printed Circuit Board Fabrication for the Realization of Stretchable Electronics

  1. Prof. Takao Someya
  1. Frederick Bossuyt1 and
  2. Thomas Löher2

Published Online: 28 DEC 2012

DOI: 10.1002/9783527646982.ch8

Stretchable Electronics

Stretchable Electronics

How to Cite

Bossuyt, F. and Löher, T. (2012) Technologies and Processes Used in Printed Circuit Board Fabrication for the Realization of Stretchable Electronics, in Stretchable Electronics (ed T. Someya), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany. doi: 10.1002/9783527646982.ch8

Editor Information

  1. The University of Tokyo, Department of Electrical Engineering and Information Systems, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan

Author Information

  1. 1

    University Ghent, 9052 Gent-Zwijnaarde, Belgium

  2. 2

    Fraunhofer IZM, Gustav-Meyer-Allee 25, 13355 Berlin, Germany

Publication History

  1. Published Online: 28 DEC 2012
  2. Published Print: 19 DEC 2012

ISBN Information

Print ISBN: 9783527329786

Online ISBN: 9783527646982

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Keywords:

  • thermoplastic polyurethane;
  • polyurethane films;
  • roll annealed (RA);
  • organic surface protection (OSP);
  • printed circuit board (PCB);
  • surface mount device (SMD)

Summary

This chapter contains sections titled:

  • Lamination Technology

  • Molding Technology

  • References