This work was supported by the National Center for Electron Microscopy, Lawrence Berkeley National Laboratory, which is funded by the U.S. Department of Energy under Contract # DE-AC02-05CH11231. DK gratefully acknowledges financial support of the Austrian Science Fund (FWF) through the project J2834-N20. Supporting Information is available online from Wiley Online Library or from the author.
Strength, Hardening, and Failure Observed by In Situ TEM Tensile Testing†
Article first published online: 7 MAY 2012
Copyright © 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Advanced Engineering Materials
Special Issue: Nanostructured Materials
Volume 14, Issue 11, pages 960–967, November 2012
How to Cite
Kiener, D., Kaufmann, P. and Minor, A. M. (2012), Strength, Hardening, and Failure Observed by In Situ TEM Tensile Testing. Adv. Eng. Mater., 14: 960–967. doi: 10.1002/adem.201200031
- Issue published online: 2 NOV 2012
- Article first published online: 7 MAY 2012
- Manuscript Accepted: 11 APR 2012
- Manuscript Received: 29 JAN 2012
- FWF: J2834-N20
We present in situ transmission electron microscope tensile tests on focused ion beam fabricated single and multiple slip oriented Cu tensile samples with thicknesses in the range of 100–200 nm. Both crystal orientations fail by localized shear. While failure occurs after a few percent plastic strain and limited hardening in the single slip case, the multiple slip samples exhibit extended homogenous deformation and necking due to the activation of multiple dislocation sources in conjunction with significant hardening. The hardening behavior at 1% plastic strain is even more pronounced compared to compression samples of the same orientation due to the absence of sample taper and the interface to the compression platen. Moreover, we show for the first time that the strain rate sensitivity of such FIB prepared samples is an order of magnitude higher than that of bulk Cu.