Communication

Comparative Analysis of Fracture Strength of Slurry and Diamond Wire Sawn Multicrystalline Silicon Solar Wafers†

  1. Chris Yang1,*,
  2. Hao Wu2,
  3. Shreyes Melkote2,*,
  4. Steven Danyluk2

Article first published online: 18 DEC 2012

DOI: 10.1002/adem.201200262

Issue

Advanced Engineering Materials

Advanced Engineering Materials

Volume 15, Issue 5, pages 358–365, May 2013

Additional Information

How to Cite

Yang, C., Wu, H., Melkote, S. and Danyluk, S. (2013), Comparative Analysis of Fracture Strength of Slurry and Diamond Wire Sawn Multicrystalline Silicon Solar Wafers. Adv. Eng. Mater., 15: 358–365. doi: 10.1002/adem.201200262

Author Information

  1. 1

    Georgia Tech Manufacturing Institute, Georgia Institute of Technology, Atlanta, GA 30332, USA

  2. 2

    The G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA

*Georgia Tech Manufacturing Institute, Georgia Institute of Technology, Atlanta, GA 30332, USA

  1. †

    This work was supported by the Silicon Solar Consortium (SiSoC), a National Science Foundation (NSF) – Industry/University Cooperative Research Center (I/UCRC). The authors thank the industry members for providing the wafers used in the study, and Mr. Ben Hollerback at MiRC, Georgia Tech, for dicing the wafers.

Publication History

  1. Issue published online: 2 MAY 2013
  2. Article first published online: 18 DEC 2012
  3. Manuscript Revised: 13 NOV 2012
  4. Manuscript Received: 15 AUG 2012

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View Full Article (HTML) Get PDF (1266K)