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Photoelastic Imaging of Residual Stress Distribution in Epoxy Interface Layers of Ceramics with Periodic Building-Block Structure

Authors


  • The financial support from DFG Reinhart Koselleck project (GR 961/32) is gratefully acknowledged. We are thankful to the Bavarian Laser Centre for laser cutting of steel grids applied for building-block arrangement.

Abstract

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Distribution of residual stresses generated by thermal expansion misfit in the epoxy interface bonding of two-dimensional sintered alumina building-block layers (tetragonal/monoclinic unit cell) is analyzed by photoelastic measurements. Additional FE calculation of Tresca's shear stress distribution in the interface bonding layer confirm a non-isostatic state of stress in the interface bonding layer with high stress anisotropy close to the building-block surfaces

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