This work was supported by the Hungarian Scientific Research Fund (OTKA) under Grants No. K109021 and K109570 (N.Q.C.), by the Russian Foundation for Basic Research (contract 13-08-90422), and Russian Federal Ministry for Education and Science (B.B.S.: Grant 14.12.31.0001; R.Z.V.: Contract No. 14.825.31.0017), by the EraNet.Rus programme (Grant STProjects-219), by the Royal Society of the UK under International Joint Project No. JP091299 and by the European Research Council under ERC Grant Agreement No. 267464-SPDMETALS (T.G.L.).
Grain Boundary Phenomena in an Ultrafine-Grained Al–Zn Alloy with Improved Mechanical Behavior for Micro-Devices†
Article first published online: 27 JAN 2014
© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Advanced Engineering Materials
Volume 16, Issue 8, pages 1000–1009, August 2014
How to Cite
Chinh, N. Q., Valiev, R. Z., Sauvage, X., Varga, G., Havancsák, K., Kawasaki, M., Straumal, B. B. and Langdon, T. G. (2014), Grain Boundary Phenomena in an Ultrafine-Grained Al–Zn Alloy with Improved Mechanical Behavior for Micro-Devices. Adv. Eng. Mater., 16: 1000–1009. doi: 10.1002/adem.201300450
- Issue published online: 18 AUG 2014
- Article first published online: 27 JAN 2014
- Manuscript Accepted: 11 DEC 2013
- Manuscript Received: 18 SEP 2013
The microstructural and mechanical properties of an ultrafine-grained (UFG) Al–Zn alloy processed by high-pressure torsion (HPT) are investigated using depth-sensing indentations, focused ion beam, scanning electron microscopy and scanning transmission electron microscopy. Emphasis is placed on the microstructure and the effects of grain boundaries at room temperature. The experiments show the formation of Zn-rich layers at the Al/Al grain boundaries that enhance the role of grain boundary sliding leading to unique plastic behavior in this UFG material. The occurrence of significant grain boundary sliding at room temperature is demonstrated by deforming micro-pillars. Our results illustrate a potential for using UFG materials as advanced functional materials in electronic micro-devices.