Reactive Ion Etching of Cylindrical Polyferrocenylsilane Block Copolymer Micelles: Fabrication of Ceramic Nanolines on Semiconducting Substrates

Authors


  • We gratefully acknowledge the financial support of this research from the Natural Sciences and Engineering Research Council of Canada (NSERC) and the Deutsche Forschungsgemeinschaft (MO 682/3-1). In addition, L. C. thanks the Ontario Government for an Ontario Graduate Scholarship (1999--2002). I. M. thanks the University of Toronto for a McLean Fellowship (1997--2003), the Ontario Government for a PREA Award (1999--2003), and the Canadian Government for a Canada Research Chair (2001). M. A. W. thanks the Canada Council for a Killam Fellowship. The authors also thank B. Tartsch for helpful discussions.

Abstract

The diblock copolymers, poly(isoprene-block-ferrocenyldimethylsilane) (PI-b-PFDMS) and poly(ferrocenyldimethylsilane-block-dimethylsiloxane) (PFDMS-b-PDMS), form cylindrical micelles with an organometallic polyferrocenylsilane core in a solvent of hexanes. These cylindrical micelles were deposited onto a Si substrate from solution by either spin or dip coating, and upon reactive ion etching, continuous ceramic nanolines with lengths of micrometers and widths as small as 8 nm were created. The nanolines were characterized by scanning force microscopy (SFM) and transmission electron microscopy (TEM), and were shown to contain Fe, Si, and O from X-ray photoelectron spectroscopy (XPS) studies. The widths of the nanolines could be varied from ca. 8 to 30 nm, depending on the composition of the corona (PI or PDMS). The oriented deposition of these cylindrical micelles can be achieved along pre-patterned grooves on a resist film using capillary forces. Following treatment with hydrogen or oxygen plasma, oriented ceramic nanolines can be fabricated. The approach reported here represents a relatively simple method to create ceramic nanolines with large aspect ratio on semiconducting substrates.

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